Electroplate Bond Blades With Hub

Product Description
Electroplate bond blades white hub are used to groove ,cut and dice silicon, GaAs, glass, ceramic, quartz and compound semiconductor material wafer in integrated chips and discrete devices production. This product has high precision and long life span. Its performance has achieved abroad advanced level.

Product Features
1. long life span
2. High precision;
3. Superthin;
4. High performance;

Example part number:


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