Diamond grinding wheel for LED substrate

The grinding wheels for LED are mainly used for back thinning of sapphire epitaxial wafer, silicon wafer, gallium arsenide and GaN wafer.

This kind of grinding wheel developed in China has superior grinding perfomance and high cost perfomance. They can be used steadily on the Japanese, Korean as well as Taiwan grinders.

Work-piece processed: sapphire epitaxial wafer, SiC substrate epitaxial wafer, Si substrate epitaxial wafer

Material of workpiece: synthetic sapphire, SiC, single crystal silicon
Grinder: SHUWA SGM-6301, NTS Nano Surface-180G, WEC, GALAXY, SPEEDFAM

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