Chuck Table for Wafer Processing

Product Features:
1.High flatness and parallelish
2.Compact and uniform microstructure with high strength
3.Good permeability and uniform adsorption affinity
4.Dressing easily

Product Description
Fine-pore cearmic chuck tables are mainly used to support and chuck the semiconductor wafer when grinding and dicing,It is applied in the process of thining,dicing,cleaning,transportation and so on.These products which have high cost performance produced by our institute can maych with the machines made in Japan,Germany,Israel,America and China.
workpiece processed:2,3,4,5,6,8,12 inches semiconductor wafer
Suitable devices:Wafer grinder,dicing machine and cleaning machine,etc
Chuck type:Fine-pore ceramic


下一篇:Ceramic Plate and Ring for Polishing